Client Background and Business Context
This customer excels in process control with a unique perspective across the semiconductor value chain. Their portfolio of cutting-edge technologies includes unpatterned wafer quality, 3D metrology from nanometer-scale transistors to micron-level die interconnects, macro defect inspection of wafers and packages, metal interconnect composition, factory analytics, and advanced semiconductor packaging lithography.
The customer sought assistance maintaining their current application system while driving alignment, consistency, and collaboration across EPM Cloud and other boundary applications.
With Trinamix’s expertise, they elevated their EPM solution to new heights across multiple ERP environments. This implementation streamlined business processes and significantly improved operational efficiency.
Client Industry
- Semiconductor
Oracle Modules Implemented
- Oracle Enterprise Performance Management Cloud
- Financial Consolidation and Close Cloud Service
- Planning and Budgeting Cloud Service
- Accounts Reconciliation Cloud Service
Project Locations
- North America
Key Solution Highlights
- Fostered alignment, consistency, and collaboration across EPM Cloud and integrated applications
- Optimized business processes for greater efficiency
Key Benefits
Improved transactional and financial accuracy
Enhanced operational efficiency
